Non-foamed polishing pad and polishing method therewith
AssigneeNihon Microcoating Co., Ltd.
InventorsHisatomo Ohno, Jun Watanabe, Toshihiro Izumi, Yasushi Yoshizawa
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AssigneeNihon Microcoating Co., Ltd.
InventorsHisatomo Ohno, Jun Watanabe, Toshihiro Izumi, Yasushi Yoshizawa
Estimating the term…
A polishing pad made of a non-foamed resin material has surface roughness Ra in the range of 0.1-10 μm, or preferably 0.5-1.5 μm and variations in thickness less than 50 μm, or preferably less than 30 μm. Its Shore D hardness is greater than 60 degrees, or preferably 68 degrees. Its compressibility is less than 3%, or preferably less than 1% and its elasticity is greater than 30%, or preferably 50%, as measured by specified methods. Grooves may be formed over 30%-70%, or preferably 40%-60% of the total area of the polishing surface. When the polishing surface is subjected to a dressing process, its surface roughness Ra is restored to 0.1-10 μm, or preferably 0.5-1.5 μm.
A polishing pad consisting substantially of a non-foamed resin material having a polishing surface with surface roughness Ra in the range of 0.1-10 μm and variations in thickness less than 50 μm.
A method of polishing a target surface of an object, said method comprising the steps of:
Dependencies are inferred from the claim text.