Process for dataching layers of material
AssigneeS.O.I. Tec Silicon on Insulator Technologies
InventorsWalter Schwarzenbach, Christophe Maleville
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Abstract
A process for detaching two layers of material according to a weakened zone defined between the layers. This process includes the thermal annealing of a structure that incorporates the layers, with the annealing bringing the temperature from a starting temperature to a final annealing temperature while evolving according to a first phase up to a transition temperature, then according to a second phase during which the rise in temperature per unit of time is greater than that of the first phase. The invention also concerns an application for using this process in a particular semiconductor fabrication technique.
Claims15
A process for detaching of two layers of material along a weakened zone defined between the layers, which process comprises thermal annealing of a structure that includes the two layers by conducting a first and second annealing phases that are separated by a transition temperature, and raising the temperature in the second annealing phase at a rate that is greater than that of the first annealing phase so as to provide an improvement in surface roughness of detached surfaces compared to those obtained by an annealing process where the temperature is uniformly raised.
Dependencies are inferred from the claim text.