Electronic component and fabricating method

A method of fabricating an electronic component comprising:

• a first step for attaching an adhesive member, which exhibits adhesiveness lower after a predetermined process, on a flat substrate;
• a second step for placing two or more electronic devices on said adhesive member while directing an active surfaces of said electronic devicesfacedown;
• a third step for molding said electronic devices using a molding material on said flat substrate;
• a fourth step for subjecting said adhesive member to said predetermined process to lower the adhesive force of said adhesive member, and for separating said molded electronic devices from said flat substrate;
• a fifth step for forming a re-wiring layer on said molded electronic devices using a metal thin film for forming bonding pads;
• a sixth step for placing other electronic devices on said molded electronic devices while allowing the active surfaces of both electronic devices to oppose each other, and for electrically connecting both electric devices through said bonding pads;
• and
• a seventh step for dicing said molded unit including said electronic devices at the molding material so as to separate the individual molded units.