Pattern forming method and method for manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsHirokazu Kato, Yasunobu Onishi, Eishi Shiobara, Daisuke Kawamura, Hiroko Nakamura
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AssigneeKabushiki Kaisha Toshiba
InventorsHirokazu Kato, Yasunobu Onishi, Eishi Shiobara, Daisuke Kawamura, Hiroko Nakamura
Estimating the term…
A pattern forming method is disclosed which comprises providing a to-be-processed film on a substrate, providing a resist film on the to-be-processed film, patterning the resist film, providing a film of a radiosensitive compound on the to-be-processed film such that the patterned resist film is covered with the film of the radiosensitive compound, subjecting the film of the radiosensitive compound to irradiation and a development process, thus exposing an upper surface of the resist film and patterning the film of the radiosensitive compound, and removing the resist film and processing the to-be-processed film, using the patterned film of the radiosensitive compound as a mask.
A pattern forming method comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.