Polymer coatings
AssigneenGimat Co.
InventorsGirish Deshpande, Andrew Tye Hunt, Subramaniam Shanmugham, Eric J. Yurtkuran, Todd Polley, Miodrag Oljara, Tzyy-Jiuan Jan Hwang, Aimee Poda, George Neuman
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AssigneenGimat Co.
InventorsGirish Deshpande, Andrew Tye Hunt, Subramaniam Shanmugham, Eric J. Yurtkuran, Todd Polley, Miodrag Oljara, Tzyy-Jiuan Jan Hwang, Aimee Poda, George Neuman
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Coatings, particularly thin films, of polymeric material are produced in accordance with the invention by applying a finely divided aerosol (N) of polymer solution to a substrate (30) and substantially simultaneously applying an energy source (38) to the applied solution to apply the solution. In cases where the polymer is cross-linking, the energy source assists in cross-linking of the polymer. The preferred energy source is a flame (38) that may optionally or desirably deposit material along with the polymer spray. One particular aspect of the invention is directed to production of polyimide films. In accordance with another aspect of the invention, the co-deposition process is used to provide thin polysiloxane coatings on glass and other substrates.
A method of depositing a polymer coating on a substrate surface comprising
A thin film layer of 5 microns or less thickness comprising a homogeneous mixture of a polymer and an inorganic material selected from, nitrides, carbides, borides, metal oxides, metalloid oxides, mixtures of metal oxides, mixtures of metalloid oxides, and mixtures of metal and metalloid oxides.
A multi-layer laminate comprising at least two outer layers of polymeric material between about 10 and about 1000 nanometers thick and at least one inorganic oxide layer between about 10 and about 1000 nanometers thick.
A method of coating a surface of a substrate with a polysiloxane coating, the method comprising,
Apparatus for depositing material on a substrate comprising
A method of applying a film of polymer 10 microns or less to a substrate, the substrate comprising suspending particulates of said polymer of mean particle size 1 micron or less in a carrier liquid to a concentration of 10 wt % or less based on weight of the carrier liquid, atomizing said suspension and directing the atomized suspension at the substrate to deposit the suspension on the substrate, and simultaneously applying heat to said deposited suspension sufficient to vaporize carrier liquid and fuse said particles into a thin film that adheres to the substrate.
A method of preparing a dielectric layer comprising depositing a thin film metal oxide and/or metalloid oxide on a substrate and subsequently depositing a thin polymer layer on said thin film metal oxide and/or metalloid oxide layer, whereby said polymer layer fills any defect in said thin film metal
Dependencies are inferred from the claim text.