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Assignee3M Innovative Properties Company
InventorsKurt C. Melancon, Timothy D. Filiatrault, Shwi-Long J. Hwang, Rodger J. Pereyra
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A pressure sensitive adhesive composition is described, comprising the reaction product of a copolymer and a bisamide crosslinking agent, (A) the copolymer comprising the reaction product of (i) a (meth)acrylate ester of a non-tertiary alcohol in which the alkyl group contains between 1 and 4 carbon atoms, inclusive, and (ii) a carboxylic acid-functional, ethylenically unsaturated co-monomer, and (B) a bisamide crosslinking agent having the formula: 1 where, R1 and R3 independently, are selected from the group consisting of H and CnH2n+1, n is an integer ranging from 1 to 5, R2 is a divalent radical selected from the group consisting of benzeno (—C6H4—), substituted benzeno, triazine, CmH2m, and combinations thereof, m is an integer ranging from 1 to 10, and the relative amounts of the carboxylic acid-functional, ethylenically unsaturated co-monomer and the bisamide crosslinking agent providing a ratio of the number of equivalents of amide groups to the number of equivalents of carboxylic acid groups of less than about 0.1. Articles made with the pressure sensitive adhesive composition and methods for its use are also described.
A pressure sensitive adhesive composition comprising the reaction product of a copolymer and a bisamide crosslinking agent,
The adhesive article of claim 11 wherein the composition further comprises an antioxidant.
The adhesive article of claim 13 wherein the relative amounts of the carboxylic acid-functional, ethylenically unsaturated co-monomer and the bisamide crosslinking agent provide a ratio of the number of equivalents of amide groups to the number of equivalents of carboxylic acid groups of less than about 0.05.
The adhesive article of claim 13 wherein the relative amounts of the carboxylic acid-functional, ethylenically unsaturated co-monomer and the bisamide crosslinking agent providing a ratio of the number of equivalents of amide groups to the number of equivalents of carboxylic acid groups is between about 0.0001 and about 0.05.
The method of claim 21 wherein at least one of the first substrate and the second substrate are operatively associated with a heat source capable of causing the temperature of the first substrate or the second substrate to be within the range from about 100° C. to about 230° C.
The method of claim 21 further comprising (D) heating at least one of the first substrate and the second substrate to a temperature within the range from about 100° C. to about 230° C. without causing the pressure sensitive adhesive to detach from the first substrate or the second substrate.
A method according to claim 27 wherein the printed circuit is a printed circuit board.
A method according to claim 27 wherein the printed circuit is a flexible circuit.
Dependencies are inferred from the claim text.