Molding die and molding method

A molding method for molding a molded product wherein a heating element that is substantially rectangular, and that is energized to generate heat through electric resistance heating, is provided on either one or both of a specular surface of a specular plate of one die and a specular surface of a specular plate of the other die disposed oppositely to the specular surface of the specular plate of the one die and a resin material is supplied between the one die and the other die, the method comprising the steps of:

• when the molding dies are opened, moving the heating element having a plate-like part by a moving means so that the heating element is separated from the specular surface of the specular plate, which is provided to said one die and/or said other die and which is kept at a temperature at which a surface of the resin material can be cooled, and abuts on abutting surfaces of heat element holders disposed on the die to which said specular plate is attached and, when said heating element abuts on said abutting surfaces, energizing said heating element to increase the temperature of said heating element;
• then, before the resin material is supplied, moving said heating element by the moving means so that said heating element abuts on the specular surface of said specular plate and, then, supplying the resin material into a cavity and, then, forming and molding the resin material by said heating element that is heated;
• de-energizing said heating element;
• and
• cooling the molded resin material via said heating element by employing the specular plate, said specular surface of which is maintained at a temperature lower than the surface temperature of said resin material.