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AssigneeOki Electric Industry Co., Ltd.
InventorTakashi Noguchi
Estimating the term…
A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.
A semiconductor device provided with a semiconductor chip and a substrate, said substrate has a first wiring layer electrically connected to said semiconductor chip and also has a surface with a terminal, comprising:
A method for mounting a semiconductor device on a printed circuit board, having a semiconductor chip, a substrate having a first wiring layer electrically connected to said semiconductor chip and also having a surface with a terminal, a solder ball connected to said terminal, a through-hole adjacent to said first wiring layer, said through-hole goes through said substrate and extends to said solder ball through said terminal, and a second wiring layer extending from said first wiring layer along an internal wall of said through-hole, said second wiring layer electrically connects between said first wiring layer and said terminal, said method comprising the steps of:
A method for repairing a semiconductor device placed on a printed circuit board and to be joined to said board with solder, said semiconductor device has a semiconductor chip, a substrate having a first wiring layer electrically connected to said semiconductor chip and also having a surface with a terminal, a solder ball connected to said terminal, a through-hole adjacent to said first wiring layer, said through-hole goes through said substrate and extends to said solder ball through said terminal, and a second wiring layer extending from said first wiring layer along an internal wall of said through-hole, said second wiring layer electrically connects between said first wiring layer and said terminal, comprising the steps of:
Dependencies are inferred from the claim text.