Semiconductor device having bump electrode
AssigneeDenso Corporation
InventorsHirofumi Abe, Hiroyuki Ban
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate, a plurality of bump electrodes disposed on the substrate, and a support area for supporting the substrate in case of carrying the substrate. The support area is disposed on a surface of the substrate, on which the bump electrode is disposed, and is disposed at a predetermined position, which is dotted on the surface of the substrate. In this device, the support area is sufficiently small, and the number of the bump electrodes can increase. Moreover, degree of freedom in a configuration of the support area increases.
Claims6
A semiconductor device, comprising:
- a substrate;
- a plurality of bump electrodes disposed on the substrate;
- and
- a support area for supporting the substrate in case of carrying the substrate,
- wherein the support area is disposed on a surface of the substrate on which the bump electrode is disposed, and is disposed at a predetermined position which is dotted on the surface of the substrate.
A semiconductor device, comprising:
- a substrate;
- a plurality of bump electrodes disposed on the substrate;
- and
- a support area for supporting the substrate in case of carrying the substrate,
- wherein the support area is formed in such a manner that a plurality of predetermined bump electrodes is eliminated so as to form the support area at a predetermined position, which is dotted on the surface of the substrate.
A semiconductor device, comprising:
- a substrate;
- a plurality of bump electrodes disposed on the substrate;
- and
- a plurality of support areas disposed on the substrate and adjacent to the bump electrodes, the support areas being located along sides of the substrate and separated one another to allow a part of bump electrodes to be located immediately adjacent to the sides of the substrate.
Dependencies are inferred from the claim text.