Device for mounting a semiconductor package on a support plate via a base
AssigneeSTMicroelectronics S.r.l.
InventorsRemi Brechignac, Kevin Channon, Juan Exposito
Life of this patent
Estimating the term…
Abstract
A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.
Claims49
A device for mounting a semiconductor package on a support plate, in which a base is inserted between a rear face of the semiconductor package and a front face of the said support plate and in which means for electrically connecting the semiconductor package to the support plate pass through the base, the device comprising:
- means for fastening the semiconductor package onto the support plate, wherein the means for fastening cooperates with and is placed below the rear face of the semiconductor package.
A semiconductor product, comprising:
- a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface and a boss member projecting rearwardly therefrom;
- a holding shoulder associated with the rearwardly projecting boss member;
- a mounting base including an aperture sized and shaped to receive the rearwardly projecting boss member;
- and
- a latch mechanism associated with the mounting base, the latch mechanism engaging the holding shoulder to retain the semiconductor package in the mounting base when the rearwardly projecting boss member is inserted into the aperture.
A semiconductor product, comprising:
- a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface;
- a peripheral rib member projecting rearwardly from the rear face surface;
- a mounting base;
- and
- a peripheral latch mechanism associated with the mounting base, the peripheral latch mechanism engaging the peripheral rib member to retain the semiconductor package to the mounting base.
A semiconductor product, comprising:
- a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface and a boss member projecting rearwardly therefrom;
- a mounting base including an aperture sized and shaped to receive the rearwardly projecting boss member;
- and
- an adhesive layer engaging the boss member to retain the semiconductor package in the mounting base when the rearwardly projecting boss member is inserted into the aperture.
A semiconductor product, comprising:
- a semiconductor package securing an integrated circuit, the semiconductor package having a rear face surface;
- a mounting base having a front and back surface and including an aperture, the semiconductor package positioned with its rear face surface adjacent the front surface of the mounting base;
- a holding lug inserted from the back surface of the mounting base, and through the aperture therein, into a position adjacent the rear face surface of the semiconductor package;
- and
- an adhesive layer between the holding lug and rear face surface of the semiconductor package to retain the semiconductor package adjacent the mounting base.
A device for mounting a semiconductor package to a supporting base, the supporting base being mounted to a printed circuit board, comprising:
- means for fastening the semiconductor package onto the supporting base, wherein the means for fastening cooperates with and is placed below a rear face of the semiconductor package;
- and
- means for making an electrical connection from the printed circuit board to the semiconductor package through the supporting base.
Dependencies are inferred from the claim text.