Embedded package for power semiconductor device

Abstract

An embedded package for power semiconductor device comprises a lead, a cup, a semiconductor device, an insulation glue and an isolation glue. The cup has a cavity, an inner wall, a gap and a heat-conductive stage therein. An annulus baffle is formed on the heat-conductive stage. The rigidity between the heat-conduction stage and bottom of the cup is larger than the rigidity between the gap and bottom of the cup to protect the semiconductor device. The semiconductor device is connected between the lead and the heat-conductive stage, and is coated by the insulation glue to prevent from leak. The isolation glue is coated on an outer face of the insulation glue to block moisture.

Dependencies are inferred from the claim text.