US 2003/0213979 A1 · Power semiconductor device

Abstract

A power semiconductor device that uses a lead frame for making connection to a semiconductor device and has a structure less subject to fatigue failure at the connection part of the lead frame. A mold resin of a casing (14) is used for integrally covering the lead frame (6, 7, 13), semiconductor device (1), and metal block (15) serving as a substrate mounting the semiconductor device (1). The mold resin surrounding the lead frame (6) and semiconductor device (1) strengthens the joint therebetween, resulting in the power semiconductor device less subject to fatigue failure at the connection part of the lead frame (6).

Claims13

Dependent claims

A power semiconductor device comprising:

a semiconductor device having a top surface and a bottom surface;
a metal block fixed on said bottom surface of said semiconductor device;
a lead frame fixed on said top surface of said semiconductor device;
and
a casing of a mold resin integrally covering said semiconductor device, said metal block and said lead frame.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/383,650Filed 10 Mar 2003

Priority

JP P2002-0634848 Mar 2002

Published

20 Nov 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10W 99/00
Subject matter not provided for in other groups of this subclass
H10W 40/73
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control: for cooling by change of state
H10W 40/778
Auxiliary members characterised by their shape: in encapsulations
H10W 70/481
Leadframes: for devices being provided for in groups H10D8/00 - H10D48/00

Power semiconductor device

Life of this patent

Power semiconductor device

Life of this patent

Abstract

Claims13