Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof

A wet treatment method of a metal-ceramic bonded member of a base integral type which is so structured that a metal-ceramic bonded member is bonded on a base member, the metal-ceramic bonded member being constituted of a ceramic substrate and a circuit pattern forming metal plate bonded on the ceramic substrate, the method comprising:

• having a masking member cover said metal-ceramic bonded member of the base integral type in which said base member is bonded on said ceramic substrate so as to be exposed in a portion surrounding said ceramic substrate, said masking member having a window portion from which said ceramic substrate is exposed;
• pressing said masking member against said exposed base member so as to prevent a treatment solution for said wet treatment from passing through a portion where said masking member and the base member exposed in the portion surrounding said ceramic substrate are in contact with each other;
• and
• during pressing said masking member, bringing the treatment solution for the wet treatment of said circuit pattern forming metal plate into contact with said circuit pattern forming metal plate.

A wet treatment equipment having a tank which feeds a treatment solution to a metal plate bonded on a substrate to perform wet treatment of the metal plate, the wet treatment equipment comprising:

• a treatment solution feeding portion, which is provided in said tank, to feed the treatment solution to said metal plate;
• a substrate setting portion, which is provided on an upper surface or a side surface of said tank, to set said substrate thereon;
• and
• an opening portion of said tank to expose to an inner part of said tank the metal plate bonded on the substrate which is set on said substrate setting portion.