Method for processing by laser, apparatus for processing by laser, and three-dimensional structure

A method for processing by laser, comprising the steps of:

• forming an absorptive thin film material layer that absorbs light on a surface of a processing object;
• and
• processing and forming directly a micro region smaller than an irradiation region of laser beam on the surface of processing object via the absorptive thin film material layer by using the relationship between the absorptive thin film material layer and the intensity distribution of the irradiation region of laser beam for processing onto the processing object.

A three-dimensional structure, comprising:

• a micro material-removing region of an absorptive thin film material layer, which has been formed by irradiating said laser beam for processing onto the absorptive thin film material layer having high absorption to said laser beam for processing, which has been formed on a surface of processing object into which the laser beam for processing is made incident, and
• a material-removing region of the processing object, which exists in the material-removing region and is finer than the material-removing region.

A three-dimensional structure, comprising:

• a micro material-removing region of a platinum layer, which has been formed by irradiating laser beam for processing onto the platinum layer having high absorption to said laser beam for processing, which has been formed on a surface of processing object into which the laser beam for processing is made incident,
• a material-removing region having the same width as the material-removing region, and
• a material-removing region of the processing object, which exists in this material-removing region and is finer than the material-removing region.