Batch type atomic layer deposition apparatus

Abstract

Provided is an atomic layer deposition apparatus that can prevent the degradation of a sheet resistance uniformity as well as enhance the throughput. The atomic layer deposition apparatus of this research includes: a rotary plate in the chamber, wherein a plurality of wafers positioned on the rotary plate to equal distances from the center of the rotary plate; a gas injecting means confronting the upper surface of the rotary plate at the center; and a heating plate cable of controlling the temperature of the wafers according to the location, wherein the heating plate is mounted on the bottom plate and a space is provided between the heating plate and the bottom surface of the rotary plate.

Dependencies are inferred from the claim text.