Copper alloy material having efficient press properties and process for production thereof
AssigneeNippon Mining & Metals Co., Ltd.
InventorsKoji Harada, Kazuhiko Fukamachi
Life of this patent
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Abstract
A copper alloy material for connectors for reducing wear of a press die, the material comprising: 25 to 40 mass % of Zn and the balance of Cu and inevitable impurities; the material having an arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material of 0.07 to 0.13 μm; maximum height (Ry) of not more than 1.3 μm; a surface oxide film having a thickness in a range of from 3 to 80 nm; and not less than 10 atom % of oxide of alloy elements, except for Cu, contained in the oxide film.
Claims30
A copper alloy material comprising:
- 25 to 40 mass % of Zn;
- and
- the balance of Cu and inevitable impurities;
- wherein arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material is 0.07 to 0.13 μm;
- maximum height (Ry) is not more than 1.3 μm;
- a surface oxide film has a thickness in a range of from 3 to 80 nm;
- and
- not less than 10 atom % of oxide of alloy elements, except for Cu, is contained in the oxide film.
A copper alloy material comprising:
- 3 to 11 mass % of Sn;
- 0.03 to 0.35 mass % of P;
- and
- the balance of Cu and inevitable impurities;
- wherein arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material is 0.07 to 0.14 μm;
- maximum height (Ry) is not more than 1.4 μm;
- a surface oxide film has a thickness in a range of from 3 to 80 nm;
- and
- not less than 10 atom % of oxide of alloy elements, except for Cu, is contained in the oxide film.
A copper alloy material comprising:
- 1.5 to 4.0 mass % of Ni;
- 0.30 to 1.2 mass % of Si;
- and
- the balance of Cu and inevitable impurities;
- wherein arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material is 0.05 to 0.15 μm;
- maximum height (Ry) is not more than 1.5 μm;
- a surface oxide film has a thickness in a range of from 3 to 80 nm;
- and
- not less than 10 atom % of oxide of alloy elements, except for Cu, is contained in the oxide film.
A copper alloy material comprising:
- 1.5 to 4.0 mass % of Ni;
- 0.30 to 1.2 mass % of Si;
- 0.05 to 0.20 mass % of Mg;
- and
- the balance of Cu and inevitable impurities;
- wherein arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material is 0.05 to 0.15 μm;
- maximum height (Ry) is not more than 1.5 μm;
- a surface oxide film has a thickness in a range of from 3 to 80 nm;
- and
- not less than 10 atom % of oxide of alloy elements, except for Cu, is contained in the oxide film.
A copper alloy material comprising:
- 0.5 to 5 mass % of Ti;
- and
- the balance of Cu and inevitable impurities;
- wherein arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material is 0.10 to 0.18 μm;
- maximum height (Ry) is not more than 2.0 μm;
- a surface oxide film has a thickness in a range of from 3 to 80 nm;
- and
- not less than 10 atom % of oxide of alloy elements, except for Cu, is contained in the oxide film.
Dependencies are inferred from the claim text.