Method and apparatus for packaging microelectronic substrates

A method for providing a reduced-volume pellet for encapsulating a microelectronic substrate, the pellet being suitable for use with a pellet-handling apparatus configured to handle cylindrical pellets having a selected length, a selected radius and a selected volume approximately equal to pi times the selected length times the square of the selected radius, the method comprising forming an uncured thermoset pellet material into a pellet body having a first end surface, a second end surface facing opposite the first end surface and an intermediate surface between the end surfaces, the pellet body having a maximum length approximately equal to the selected length, a maximum cross-sectional dimension approximately equal to twice the selected radius and a volume less than the selected volume by at least about 5%.

A pellet for packaging at least one microelectronic substrate, comprising:

• a pellet body formed from an uncured thermoset mold material and having a first end surface, a second end surface facing opposite the first end surface, and an intermediate surface between the first and second end surfaces, the first end surface, the second end surface and the intermediate surface defining an internal volume;
• and
• at least one cavity wall in the body defining a cavity in the body.

A reduced-volume pellet for packaging a microelectronic substrate, the reduced-volume pellet being useable with a pellet handling apparatus configured to handle cylindrical pellets having a selected length, a selected radius transverse to the selected length, and a selected volume approximately equal to pi times the selected length times the square of the selected radius, the reduced-volume pellet comprising a pellet body formed from an uncured thermoset mold material, the pellet body having a maximum body length approximately equal to the selected length and a maximum body cross-sectional dimension approximately equal to twice the selected radius, the pellet body further having a volume of uncured mold material at least 5% less than the selected volume.

A set of pellets for packaging microelectronic substrates in a single mold, comprising:

• a first pellet formed from a first uncured mold material and having a first length, a first radius transverse to the first length, and a first volume of the first uncured mold material less than or equal to pi times the first length times the square of the first radius;
• and
• a second pellet formed from a second uncured mold material having a composition the same as a composition of the first uncured mold material, the second pellet having a maximum body length approximately equal to the first length and a maximum body cross-sectional dimension approximately equal to twice the first radius, the second pellet further having a second volume of the second uncured mold material less than first volume of the first uncured mold material.

An apparatus for packaging a microelectronic substrate, comprising:

• a mold body having a chamber with a first portion configured to extend at least partially around the microelectronic substrate and a second portion coupled to the first portion;
• and
• a plunger positioned in the second portion of the chamber and moveable within the second portion of the chamber in an axial direction between a first position and a second position, the plunger having a side wall aligned with the axial direction and an end wall transverse to the axial direction, at least a portion of the end wall extending axially away from the side wall.

An apparatus for packaging a microelectronic substrate, the apparatus useable with a pellet of uncured thermoset material having an end surface with a cavity, the apparatus comprising:

• a mold body having a chamber with a first portion configured to extend at least partially around the microelectronic substrate and a second portion coupled to the first portion, the second portion having a protrusion configured to be received in the cavity of the pellet;
• and
• a plunger positioned in the second portion of the chamber opposite the protrusion and moveable within the second portion of the chamber in an axial direction between a first position and a second position, the plunger having a side wall aligned with the axial direction and an end wall transverse to the axial direction and facing toward the protrusion.