Semiconductor device having semiconductor chips mounted on package substrate
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShinji Baba
Life of this patent
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Abstract
A first semiconductor chip is disposed in an opening of a package substrate, and a second semiconductor chip is disposed so as to face the first semiconductor chip and interconnected through a bump. The second semiconductor chip is electrically connected to a plurality of input terminals of the package substrate through the bump. The package substrate comprises a multi-layer wiring connected to the plurality of input terminals and formed in the substrate, and comprises a plurality of output terminals connected to the multi-layer wiring. Solder balls connected to the output terminals are provided on the back of the package substrate.
Claims13
A semiconductor device comprising:
- a substrate having an opening, said substrate having:
- a plurality of input terminals formed on the surface of said substrate;
- a multi-layer wiring formed in said substrate and connected to said input terminals;
- and a plurality of output terminals connected to said multi-layer wiring;
- a first semiconductor chip disposed in the opening;
- and
- a second semiconductor chip disposed so as to face said first semiconductor chip and electrically connected to said first semiconductor chip and said input terminals.
A semiconductor device comprising:
- a substrate having an opening, said substrate having:
- a plurality of input terminals formed on the surface of said substrate;
- a multi-layer wiring formed in said substrate and connected to said input terminals;
- and a plurality of output terminals connected to said multi-layer wiring;
- a semiconductor chip disposed above the opening and electrically connected to said input terminals;
- and
- a chip capacitor disposed on said semiconductor chip so as to face the opening.
Dependencies are inferred from the claim text.