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US 2003/0209807 A1Published application
Organic substrate for flip chip bonding
AssigneeKabushiki Kaisha Toshiba
InventorEiichi Hosomi
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Abstract
An exemplary embodiment of the present invention described and shown in the specification and drawings is a substrate that has lattice points and interstitial points. The substrate includes a surface, a plurality pads located on the surface at interstitial points, and a plurality of vias located in the substrate only at lattice points.
Claims20
A substrate, having lattice points and interstitial points, comprising:
- a surface;
- a plurality of pads located on the surface at interstitial points;
- and
- a plurality of vias located in the substrate only at lattice points.
1 more element
A semiconductor package comprising:
- a semiconductor die having a die edge;
- and
- a substrate, having lattice points and interstitial points, connected to the semiconductor die, the substrate including;
- a surface;
- a plurality of pads located on the surface at interstitial points;
- and
- a plurality of vias located in the substrate only at lattice points.
4 more elements
A method for configuring vias in a substrate having lattice points and interstitial points and for configuring pads on the surface of the substrate, the method comprising:
- locating pads on the surface of the substrate at interstitial points;
- and
- locating vias in the substrate only at lattice points.
Dependencies are inferred from the claim text.