Reactive solder material
AssigneeIntel Corporation
InventorsFay Hua, Carl L. Deppisch, Krista J. Whittenburg
Life of this patent
Estimating the term…
Abstract
Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.
Claims28
An apparatus comprising:
- a silicon-based semiconductor surface;
- and
- a reactive solder material on said semiconductor surface, said reactive solder material including a base solder material alloyed with an active element material to bond to said silicon-based semiconductor surface and to have no significant impact on a solidus temperature of said reactive solder material.
An apparatus comprising:
- a thermal management device;
- and
- a reactive solder material coupled to a portion of said thermal management device, said reactive solder material including a base solder material alloyed with an active element material to have no significant impact on a solidus temperature of said reactive solder material and for bonding to a silicon-based surface.
An apparatus comprising:
- a silicon-based semiconductor surface;
- a reactive solder material bonded to said semiconductor surface, said reactive solder material including a base solder material alloyed with an active element material to bond to said silicon-based semiconductor surface and to have no significant impact on a solidus temperature of said reactive solder material;
- and
- a thermal management device bonded to said reactive solder material, said reactive solder material to act as an interface between said semiconductor surface and said thermal management device.
A reactive solder material comprising:
- a base solder material;
- and
- an active element material alloyed with said base solder material and to bond to a silicon-based semiconductor surface, said active element material to have no significant impact on a solidus temperature of said reactive solder material.
A method comprising:
- applying a reactive solder material to a semiconductor surface;
- and
- soldering the reactive solder material to secure a thermal management device to the semiconductor surface in a fluxless manner.
A method comprising:
- applying a reactive solder material to a portion of a thermal management device;
- and
- soldering the reactive solder material in a fluxless manner.
Dependencies are inferred from the claim text.