Apparatus for providing mechanical support to a column grid array package

A column grid array package for mounting integrated circuit chips onto a printed circuit board, said column grid array package comprising:

• a substrate having two sides, wherein an integrated circuit chip is mounted on one of said two sides and a plurality of input/output pads are located on another one of said two sides;
• a plurality of wire columns attached between said plurality of input/output pads and said printed circuit board;
• and
• an L-shape metal corner post located at a corner of said substrate to fasten the position of said substrate in relation to said printed circuit board to prevent any movement between said substrate in relation to said printed circuit board in the presence of vibrations on said column grid array package.

A method for providing corner posts to a column grid array package, said method comprising:

• bonding a plurality of wire columns to a substrate;
• attaching said plurality wire columns to a printed circuit board;
• affixing a corner post at each corner of said substrate;
• and
• applying epoxy between a bottom surface of each of said corner posts and said printed circuit board to secure the position of said substrate in relation to said printed circuit board.