Semiconductor device package
AssigneeFurukawa Electric Co., Ltd.
InventorsTakahiro Okada, Hideaki Murata
Life of this patent
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Abstract
A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.
Claims12
A semiconductor device package comprising:
- a metal base having a placement section configured to hold a semiconductor device;
- a metal frame having a rectangular shape in transverse cross section and having a first face joined to the metal base and a second face;
- and
- a metal lid seam-welded to the second face, wherein the second face comprises a warp configured concavely on at least two opposite sides of the second face toward the lid, and
- said warp comprises a maximum warpage larger than 0.0% and not larger than 0.2% of a length of one of the at least two opposite sides containing said warp.
A semiconductor device package comprising:
- a metal base having a placement section configured to hold a semiconductor device;
- a metal frame having a rectangular shape in transverse cross section and having a first face thereof joined to the metal base and a second face;
- a seal ring having a first face and a second face, the first face of the seal ring being joined to the second face of the metal frame;
- and
- a metal lid seam-welded to the second face of the seal ring wherein the second face of the seal ring comprises a warp configured concavely on at least two opposite sides of the second face of the seal ring toward the lid, and said warp comprising a maximum warpage larger than 0.0% and not larger than 0.2% of a length of one of the at least two opposite sides containing said warp.
A method of manufacturing a semiconductor device package, comprising the steps of:
- joining a first face of metal frame having a rectangular shape in transverse cross section to a metal base having a placement section configured to hold a semiconductor device;
- and
- seam-welding a metal lid to a second face of the metal frame, said metal frame configured to provide a restoration force while seam-welding so as to increase weld quality;
- wherein
- the second face comprises a warp configured concavely on at least two opposite sides of the second face toward the lid, and
- said warp comprises a maximum warpage larger than 0.0% and not larger than 0.2% of a length of one of the at least two opposite sides containing said warp.
A method of manufacturing a semiconductor device package, comprising the steps of:
- joining a first face of a metal frame having a rectangular shape in transverse cross section to a metal base having a placement section configured to hold a semiconductor device;
- joining a first face of a seal ring to a second face of the metal frame;
- and
- seam-welding a metal lid to a second face of the seal ring, said metal frame configured to provide a restoration force while seam-welding so as to increase weld quality;
- wherein
- the second face of the seal ring comprises a warp configured concavely on at least two opposite sides of the second face of the seal ring toward the lid, and
- said warp comprising a maximum warpage larger than 0.0% and not larger than 0.2% of a length of one of the at least two opposite sides containing said warp.
Dependencies are inferred from the claim text.