Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
AssigneeSTMicroelectronics S.r.I.
InventorsPaolo Casati, Amedeo Maierna, Bruno Murari
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Abstract
An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.
Claims30
An assembly structure for an electronic integrated power circuit, which circuit is formed on a semiconductor die comprising a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, characterized in that it comprises a shield element coupled thermally to said die by a layer of an adhesive material.
A process for manufacturing an assembly structure for an electronic integrated power circuit formed on a semiconductor die comprising a plurality of leads, the process comprising the following step:
- providing a plurality of contact pads in a peripheral area of an active face of said die;
- characterized in that it comprises the following steps:
- forming a layer of an adhesive material on said active face of the die;
- adhering said die on a shield element by means of said adhesive layer;
- aligning said contact pads to said leads, and connecting said contact pads mechanically and electrically to said leads;
- holding and trimming said leads, and concurrently forming the leads to a gullwing shape.
An integrated circuit, comprising:
- a semiconductor die having a first side and a contact pad disposed on the first side;
- a lead electrically connected to the contact pad;
- and
- an electromagnetic shield thermally coupled to the first side of the semiconductor die.
A method, comprising:
- attaching a first side of a die to an electromagnetic-shielding portion of a lead frame;
- and
- bonding leads from the lead frame to contacts located on the first side of the die.
A method, comprising:
- attaching a first side of a die to a center portion of a lead frame;
- and
- attaching leads from the lead frame directly to respective contacts located on the first side of the die.
Dependencies are inferred from the claim text.