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US 2003/0209731 A1Published application
Circuit component placement
AssigneeLSI Logic Corporation
InventorsAnwar Ali, Tauman T. Lau, Max M. Yeung, Ken Nguyen, Wei Huang
Life of this patent
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AssigneeLSI Logic Corporation
InventorsAnwar Ali, Tauman T. Lau, Max M. Yeung, Ken Nguyen, Wei Huang
Estimating the term…
A method for designing an input output cell of an integrated circuit. The input output cell has a required area, a width, and a height. The bonding pad pitch length between adjacent bonding pads of the integrated circuit is measured. The width of the input output cell is specified to be substantially equal to the bonding pad pitch length. The required area is divided by the width to determine a first value, and the height of the input output cell is specified to be substantially equal to the first value. In this manner, the width of the input output cells is no greater than the distance between two adjacent bonding pads, and thus the input output cells can be placed very close together, facilitating their use in input output limited integrated circuit designs. However, the height of the input output cells is no greater than is necessary to enclose the required area of the input output cell, thus facilitating their use in core limited integrated circuit designs. In various preferred embodiments, the bonding pads for the input output cells are disposed within their surface areas, thereby further reducing the surface area of the integrated circuit that is required for the input output functions of the integrated circuit.
In an input output cell of the type used in an integrated circuit, the improvement comprising the input output cell having an aspect ratio of less than about two and more than about one half.
In an integrated circuit, the improvement comprising a first ring of first input output cells disposed near a peripheral edge of the integrated circuit, each of the first input output cells having an associated bonding pad disposed at a first relative position to each of the first input output cells, and a second ring of second input output cells disposed interior to the first ring of first input output cells, each of the second input output cells having an associated bonding pad disposed at a second relative position to each of the second input output cells, where the first relative position is offset from the second relative position.
In a method for designing an input output cell of an integrated circuit, the input output cell having a required area, a width, and a height, the improvement comprising the steps of:
In an integrated circuit, the improvement comprising:
Dependencies are inferred from the claim text.