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US 2003/0209255 A1Published application
Backside etching in a scrubber
AssigneeApplied Materials, Inc.
InventorsBrian J. Brown, Madhavi Chandrachood, Radha Nayak, Fred C. Redeker, Michael Sugarman, John M. White
Life of this patent
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Abstract
A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
Claims26
A method of cleaning a frontside of a wafer and etching a backside of the wafer, comprising:
- (1) scrubbing a frontside of a wafer positioned on a support mechanism;
- (2) directing an etching fluid to a backside of the wafer positioned on the support mechanism;
- and
- (3) directing a cleaning fluid to the frontside of the wafer positioned on the support mechanism;
- wherein the etching fluid etches a material from the backside of the wafer, and wherein the non-etching fluid does not etch the material from the front side of the wafer.
2 more elements
Dependencies are inferred from the claim text.