Apparatus for analyzing a failure of a semiconductor device and method therefor
AssigneeDongbu Electronics Co., Ltd.
InventorKi Won Hong
Life of this patent
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Abstract
In an apparatus for analyzing a failure of a semiconductor device, a wafer map memory stores test result data of each test wafer. A failure die number/rate, a D/S good die number/yield and a FBM good die number/yield on each test mode of each test wafer are calculated. In case a failure bit mode to be defined is selected from a plurality of failure bit modes, a failure die rate for total dies and a failure die rate for total failure dies are calculated. An expected FBM yield, an expected D/S yield, an average D/S yield, and a maximum/minimum yield are calculated. The calculated values are displayed on a monitor.
Claims4
An apparatus for analyzing a failure of a semiconductor device, which calculates a failure die number/rate, a FBM yield and a D/S yield on a test mode of each test wafer, the apparatus comprising:
- a wafer map memory for storing test result data of said each test wafer;
- a means for calculating a failure die number/rate, a D/S good die number/yield and a FBM good die number/yield on the test mode of said each test wafer;
- a means for storing the calculated values;
- a means for calculating, in case a failure bit mode to be defined is selected from a plurality of failure bit modes, a failure die rate for total dies and a failure die rate for total failure dies based on a total die number and a failure die number of the selected failure bit mode;
- a means for calculating an expected FBM yield based on the FBM yield and the failure die rate for the total dies and calculating an expected D/S yield based on the expected FBM yield, the FBM yield and the D/S yield;
- a means for calculating an average D/S yield of the selected failure bit mode based on the expected FBM yield, the FBM yield and the D/S yield of the selected test wafer;
- a means for calculating a maximum/minimum yield based on the expected FBM yield, and a minimum and a maximum deviation value between the FBM yield and the D/S yield;
- and
- a means for displaying the calculated values on a monitor.
A method for analyzing a failure of a semiconductor device, which calculates a failure die number/rate, a FBM yield and a D/S yield on a test mode of each test wafer, the method comprising the steps of:
- (a) calculating a failure die number/rate, a D/S good die number/yield and a FBM good die number/yield on the test mode of said each test wafer;
- (b) waiting for a user to select a failure bit mode to be defined from a plurality of failure bit modes;
- (c) selecting a certain failure bit mode as a failure bit mode to be defined, and calculating a failure die rate for total dies and a failure die rate for total failure dies based on a total die number and a failure die number of the selected failure bit mode;
- (d) calculating an expected FBM yield based on the FBM yield and the failure die rate for the total dies;
- (e) calculating an expected D/S yield based on the expected FBM yield, the FBM yield and the D/S yield;
- (f) calculating an average D/S yield of the selected failure bit mode based on the expected FBM yield, the FBM yield, and the D/S yield of the selected test wafer;
- (g) calculating a maximum and a minimum yield based on the expected FBM yield, and a maximum and a minimum deviation value between the FBM yield and the D/S yield;
- (h) displaying the calculated values on a monitor;
- and
- (i) iteratively performing the steps (c) to (h) whenever a new failure bit mode is selected as a failure bit mode to be defined.
Dependencies are inferred from the claim text.