Semiconductor device and method for manufacturing the same
AssigneeOki Electric Industry Co., Ltd.
InventorKiyoshi Hasegawa
Life of this patent
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Abstract
A semiconductor device includes a semiconductor substrate which has a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a central area and a peripheral area surrounding the central area, and a first steplike section formed in the peripheral area.
Claims28
A semiconductor device comprising:
- a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
- and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
- wherein the second main surface has a central area and a peripheral area which surrounds the central area, and a first steplike section is formed in the peripheral area.
A semiconductor device comprising:
- a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
- and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
- wherein the second main surface has a central area and a peripheral area which surrounds the central area, the distance from the first main surface to the second main surface is a first distance in the central area, and the distance from the first main surface to the second main surface is a second distance shorter than the first distance in the peripheral area.
A semiconductor device comprising:
- a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
- and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
- wherein the second main surface has a central area and a peripheral area which surrounds the central area, and the peripheral area is rougher than the second main surface in the central area.
A semiconductor device comprising:
- a semiconductor substrate having a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface;
- and a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements,
- wherein the second main surface has a central area and a peripheral area which surrounds the central area, a steplike section is formed in the peripheral area, the thickness of the semiconductor substrate is a first thickness in the central area, and a second thickness thicker than the first thickness in the peripheral area.
Dependencies are inferred from the claim text.