BGA/LGA with built in heat slug/spreader
AssigneeSTMicroelectronics S.r.l.
InventorTiao Zhou
Life of this patent
Estimating the term…
Abstract
A ball or land grid array plastic substrate portion is formed with a hole therethrough in the region on which the integrated circuit die is to be formed, with a copper heat slug inserted within the opening having a bottom surface substantially aligned with the bottom surface of the plastic portion to allow molding tooling for conventional ball or land grid array packages to be employed. The integrated circuit die is mounted on the heat slug, which has a solderable bottom surface and is directly soldered to the PCB. An additional copper heat spreader region is formed on an upper surface of the plastic portion.
Claims20
A substrate for a ball or land grid array package comprising:
- an insulative layer having an opening therethrough at a region on which an integrated circuit die is to be mounted on the substrate, a bottom surface of the insulative layer adapted for bearing a plurality of contact regions;
- and
- a thermally conductive material within the opening and having a bottom surface which is solderable and substantially aligned with the bottom surface of the insulative layer, an upper surface of the thermally conductive material adapted for receiving the integrated circuit die thereon.
A ball or land grid array integrated circuit package comprising:
- a substrate including:
- an insulative layer having an opening therethrough at a region on which an integrated circuit die is to be mounted on the substrate, a bottom surface of the insulative layer adapted for bearing a plurality of contact regions;
- and
- a thermally conductive material within the opening and having a bottom surface which is solderable and substantially aligned with the bottom surface of the insulative layer, an upper surface of the thermally conductive material adapted for receiving the integrated circuit die thereon;
- an integrated circuit die mounted over the upper surface of the thermally conductive material;
- bond wires connected to the integrated circuit die;
- and
- an encapsulating material over the integrated circuit die and bond wires and over an upper surface of the thermally conductive material and at least a portion of the insulative layer.
A method of forming substrate for a ball or land grid array package comprising:
- forming an opening through an insulative layer at a region on which an integrated circuit die is to be mounted on the substrate, a bottom surface of the insulative layer adapted for bearing a plurality of contact regions;
- and
- inserting a thermally conductive material within the opening, the thermally conductive material having a bottom surface which is solderable and substantially aligned with the bottom surface of the insulative layer, an upper surface of the thermally conductive material adapted for receiving the integrated circuit die thereon.
Dependencies are inferred from the claim text.