Universial energy conditioning interposer with circuit architecture

An energy conditioning interposer circuit assembly comprising:

• a plurality of common electrodes, wherein said plurality of common electrodes comprises at least a central common electrode, a first common electrode, and a second common electrode;
• at least one pair of differential electrodes, wherein said at least one pair of differential electrodes comprises at least a first differential electrode and a second differential electrode;
• wherein said first differential electrode is stacked above said central common electrode and said second differential electrode is stacked below said central common electrode, wherein said first differential electrode and said second differential electrode sandwich said central common electrode;
• wherein said first common electrode is stacked above said first differential electrode and said second common electrode is stacked below said second differential electrode;
• wherein said first differential electrode and said second differential electrode include a plurality of electrode termination extensions protruding through an insulation band extending about the perimeter of each electrode, wherein said electrode termination extensions provide an area for conductive attachment to an external energy utilizing circuit;
• and
• said plurality of common electrodes and said at least one pair of differential electrodes form a plurality of energy conditioning elements.

An energy conditioning interposer for energized circuitry comprising:

• means for simultaneously conditioning differential and common mode energy;
• means for decoupling differential and common mode energy;
• and
• means for partially suppressing internally generated energy parasitics from said circuit conditioning electronic component.

A circuit assembly comprising:

• an integrated circuit package including an integrated circuit die;
• an energy conditioning interposer comprising a first and second differential conductive energy pathway, a plurality of common conductive energy pathways, wherein said at least one of said plurality of common conductive energy pathways is positioned above and below each of said first and second differential conductive energy pathways, and wherein said plurality of common conductive energy pathways are electrically interconnected and connected to a metallized portion of said integrated circuit package;
• at least one internal energy utilizing load electrically connected to said first and second differential conductive energy pathways;
• wherein said plurality of common conductive energy pathways and said first and second differential conductive pathways form a plurality of energy conditioning elements.

An energy conditioning interposer assembly comprising:

• at least one pair a differential conductive electrodes each having at least two conductive apertures therethrough;
• at least three common conductive electrodes each having at least two conductive apertures therethrough;
• wherein each differential conductive electrode is sandwiched by an upper and a lower common conductive electrode;
• wherein each differential conductive electrode and each common conductive electrode is positioned within said interposer in a generally parallel and stacked orientation and electrically insulated from each other by a dielectric material;
• and
• an outer conductive side surface electrically connected to each said common conductive electrode such that each said differential conductive electrode is shielded by said common conductive electrodes and said outer conductive side surface through which conductive pathways oriented generally perpendicular to said differential conductive electrode provide connection to an external electrical circuit through said at least two conductive apertures;
• wherein said common conductive electrodes, said outer conductive side surface, and said at least one pair of differential electrodes form a plurality of energy conditioning elements.