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US 2003/0205368 A1Published application
Adhesive to attach a cooling device to a thermal interface
AssigneeIntel Corporation
InventorChia-Pin Chiu
Life of this patent
Estimating the term…
Abstract
A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling device. The device to be cooled is attached to the thermal interface.
Claims19
A method of providing thermal connection between a cooling device and a device to be cooled, the method comprising:
- a. applying an adhesive to a thermal interface outside a heat transfer area of the thermal interface;
- b. attaching the thermal interface to the cooling device;
- and
- c. attaching the device to be cooled to the thermal interface.
1 more element
An apparatus to provide thermal connection between a cooling device and a device to be cooled, the apparatus comprising:
- a thermal interface that includes a heat transfer area;
- an adhesive applied to the thermal interface outside the heat transfer area;
- and
- a cooling device to which the thermal interface is attached.
1 more element
An apparatus comprising:
- a thermal interface that includes a first surface with a heat transfer area and a second surface;
- an adhesive applied to the first surface outside the heat transfer area;
- a cooling device attached to the thermal interface at said first surface thereof;
- and
- a device to be cooled attached at said second surface of the thermal interface.
2 more elements
Dependencies are inferred from the claim text.