Single wafer type substrate cleaning method and apparatus
AssigneeSes S.A.
InventorKizoh Shibagaki
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Abstract
A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.
Claims12
A single wafer type substrate cleaning method of wet-cleaning wafers individually, which are not stored in a cassette, in a sealed cleaning housing, said method consisting of:
- sequentially supplying a plurality of chemical fluids from upper side supply nozzles to the front face of each wafer from above, which wafer is rotatably supported in the cleaning housing;
- and
- injecting and supplying purified water from a lower side supply nozzle to the back face of each wafer during the cleaning of the front face thereof by chemical fluids.
A single wafer type substrate cleaning apparatus for cleaning wafers, individually which are not stored in a cassette, in a sealed cleaning housing, said apparatus comprising:
- wafer rotary means for supporting and rotating a single wafer in the cleaning housing in the horizontal position;
- a cleaning chamber provided at the outer peripheral portion of the wafer rotary means for forming a cleaning treatment space for cleaning each wafer which is rotatably supported by the wafer rotary means;
- chemical fluid supply means for supplying chemical fluids to the front face of each wafer which is rotatably supported by the wafer rotary means;
- purified water supply means for supplying purified water to the back face of each wafer which is rotatably supported by the wafer rotary means;
- wherein a plurality of chemical fluids is sequentially supplied from the chemical fluid supply means to the front face of each wafer from above, which wafer is rotatably supported by the wafer rotary means, and at the same time purified water is injected and supplied from the purified water supply means to the back face of each wafer.
Dependencies are inferred from the claim text.