Method of forming tungsten-coated W-Cu composite powder and use of the same

Abstract

Disclosed is a method of forming a W—Cu composite powder having a Cu particle surrounded by tungsten by mixing and pulverizing tungsten oxide powder and copper oxide powder using turbular mixing or ball milling, reducing the Cu powder firstly at 200˜400° C. under a hydrogen atmosphere or a reducing gas environment including hydrogen, generating W nuclei on the reduced Cu powder at 500˜700° C., and growing the generated W nuclei at 750˜1080° C. as well as a use of the same for the use of powder injection molding.

Dependencies are inferred from the claim text.