Solventless photo-sensitive thermosetting-type ink
OwnerMichael Chen, Todd Yehinventors
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Abstract
The present invention relates to a solventless photo-sensitive thermosetting type of material, a method for manufacturing the same, and its use; wherein said solventless photo-sensitive thermosetting type of material mainly comprises an aqueous alkaline-developable photo-sensitive resin, unsaturated monomer(s), epoxy resin(s), photo initiator(s), and is manufactured through a ring-opening condensation reaction as an initiation step, which is characterized in that a photo-sensitive monomer containing an unsaturated bond is used to replace organic solvent(s) regularly used in conventional solder mask products.
Claims10
A method for producing a solventless photo-sensitive thermosetting-type ink, which comprises the following steps:
- synthesizing step:
- Using an epoxy resin as a base to perform a ring-opening condensation reaction with an unsaturated acid, adding suitable unsaturated monomer(s) into the mixture for dilution;
- wherein said epoxy resin at least includes:
- Bisphenol-A epoxy resin, Bisphenol-F epoxy resin, Phenol novolac epoxy resin, Cresol novolac epoxy resin;
- Allowing the reaction mixture from the synthesizing step, poly-anhydride(s), and suitable monomer(s) to perform reactions;
- mixing and milling step:
- Adding the photo-sensitive resin obtained from the intermediate step with suitable photo initiator(s), curing agent(s), inorganic filler(s), pigment(s), de-foamer, and rheological agent(s).
A method of using a solventless photo-sensitive thermosetting type of material, which comprises using said material as solder mask, and using a projection-type UV exposure and an aqueous alkali developing step to eliminate the pre-baking process, so as to simplify the production process and improve the yield.
Dependencies are inferred from the claim text.