Method and apparatus for peeling protective sheet
AssigneeLintec Corporation
InventorMasaki Tsujimoto
Life of this patent
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Abstract
Chips C which have already been diced are attached to a ring frame F using an adhesive sheet, and a protective sheet S1 is attached to a circuit pattern surface of the chips C. The chips C, along with a ring frame F, are held in place on a table 27 of a protective sheet peeling apparatus 20. A supply portion for an adhesive tape T is disposed in the vicinity of a table 24, and the supplied adhesive tape T is attached to the protective sheet S1. When the protective sheet S1 is peeled from the circuit pattern surface, peeling starts from corner portions of the chips C or opposing corner positions by pulling the adhesive tape T.
Claims4
A method for peeling a protective sheet that is attached to a circuit pattern surface after a dicing before grinding method is conducted on a semiconductor wafer on which the circuit pattern is formed and the semiconductor wafer is divided into chips, wherein the protective sheet is peeled from corner portions of the chips.
An apparatus for peeling a protective sheet that is attached to a circuit pattern surface after a dicing before grinding method is conducted on a semiconductor wafer on which the circuit pattern is formed and the semiconductor wafer is divided into chips, wherein a rotatable table on which the chips are placed is provided and a rotational position of the table is controlled so that the protective sheet is peeled from corner portions of the chips.
Dependencies are inferred from the claim text.