Method for forming micropore, method for manufacturing semiconductor device, semiconductor device, display unit, and electronic device

A method of forming micropores in a substrate, comprising:

• forming a photosensitive material layer on the substrate using a positive photosensitive material;
• arranging the substrate and a holographic mask, which has a pattern that is formed by an off-axis holographic exposure process and has high resolution in a predetermined direction, such that the holographic mask face is parallel to the substrate face and the reference direction of the holographic mask face forms a predetermined angle with respect to the reference direction of the substrate face, applying a reconstruction beam on the holographic mask to allow the holographic mask to emit a first diffracted beam, and then exposing the photosensitive material layer to the first diffracted beam;
• varying the angle formed by the reference direction of the holographic mask face and the reference direction of the substrate face, applying the reconstruction beam on the holographic mask to allow the holographic mask to emit a second diffracted beam, and then exposing the photosensitive material layer to the second diffracted beam;
• removing unnecessary portions from the photosensitive material layer by developing the photosensitive material layer;
• and
• forming micropores in the substrate by etching the substrate using the resulting photosensitive material layer on the substrate;
• the intensity of the first diffracted beam and the intensity of the second diffracted beam being lower than intensity that is sufficient to cause a photochemical reaction in the photosensitive material, and the total intensity of the first and second diffracted beams being higher than the intensity that is sufficient to cause a photochemical reaction in the photosensitive material.

A method of forming micropores in a substrate, comprising:

• forming a photosensitive material layer on the substrate using a negative photosensitive material;
• arranging the substrate and a holographic mask, which has a pattern that is formed by an off-axis holographic exposure process and has high resolution in a predetermined direction, such that the holographic mask face is parallel to the substrate face and the reference direction of the holographic mask face forms a predetermined angle with respect to the reference direction of the substrate face, applying a reconstruction beam on the holographic mask to allow the holographic mask to emit a first diffracted beam, and then exposing the photosensitive material layer to the first diffracted beam;
• varying the angle formed by the reference direction of the holographic mask face and the reference direction of the substrate face, applying the reconstruction beam on the holographic mask to allow the holographic mask to emit a second diffracted beam, and then exposing the photosensitive material layer to the second diffracted beam;
• removing unnecessary portions from the photosensitive material layer by developing the photosensitive material layer;
• and
• forming micropores in the substrate by etching the substrate using the resulting photosensitive material layer on the substrate;
• the first and second diffracted beams independently having intensity that is sufficient to cause a photochemical reaction in the photosensitive material.