Pickup apparatus, pickup method and method for manufacturing semiconductor device
OwnerTomoyuki Shindoinventor
Life of this patent
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Abstract
A pickup apparatus in accordance with the present invention pertains to a pickup apparatus that picks up semiconductor chips 1 obtained by dicing a wafer into individual pieces, and is equipped with a chip retaining section 2 with a suction section 3 that sucks and retains a semiconductor chip 1 after dicing, a plurality of minute pores of porous material provided at the suction section 3, and a vacuum pump 4 that evacuates and exhausts gas from the minute pores. By this, occurrences of pickup errors can be suppressed even when semiconductor chips in various sizes and shapes are picked up.
Claims10
A pickup apparatus for transferring semiconductor chips that have been diced, said apparatus comprising:
- a chip retaining section having a suction section for engaging the semiconductor chips, said suction section being made from porous material;
- and
- a vacuum pump connected to the suction section for drawing a vacuum through the porous material sufficient to hold the chips against the suction section.
A pickup method for picking up semiconductor chips, said method comprising:
- dicing a semiconductor wafer into an array of chips;
- transferring the chips to a retaining device by drawing a vacuum through a porous surface in the device;
- and
- moving a collet over one of the chips, and picking up the semiconductor chip by the collet.
A method for manufacturing a semiconductor device comprising:
- adhering a wafer to an adhesive tape;
- dicing the wafer into individual semiconductor chips;
- engaging the chips with a chip retaining device;
- drawing a vacuum through a porous section of the retaining device;
- peeling away the adhesive tape from one side of the chips while the other side of the chips are held against the retaining device by the vacuum;
- moving a collect over one of the chips;
- and
- picking up the semiconductor chip with the collet.
Dependencies are inferred from the claim text.