Heat sink

A heat sink for cooling an electronic component, said heat sink comprising:

• a heat sink base;
• a heat sink contact surface adapted for thermal contact with an electronic component to be cooled, said heat sink contact surface and said heat sink base forming a wall having an upper side, said wall having a slot therein proceeding into said wall from said upper side;
• and
• a clamp element received in said slot and disposed to clamp a component to be cooled between said clamp element and said heat sink contact surface.

A heat sink for cooling an electronic component, comprising:

• a heat sink base;
• a heat sink contact surface adapted for thermal contact with an electronic component to be cooled, said heat sink contact surface and said heat sink base forming a wall having an upper side, said wall having a slot therein proceeding into said wall from said upper side;
• at least one SMT fastening surface disposed at an underside of said heat sink base substantially at a right angle relative to said heat sink contact surface;
• a suction face adapted to interact with an SMT pipette, said suction face being connected to said heat sink base substantially at a right angle to said heat sink contact surface and above said SMT fastening surface;
• and
• a clamp element received in said slot and disposed to clamp a component to be cooled between said clamp element and said heat sink contact surface.

An electronic circuit comprising:

• a circuit board;
• an electronic component mounted on said circuit board;
• and
• a heat sink comprising a heat sink base in thermal communication with a heat sink contact surface, in thermal contact with said electronic component to cool said electronic component, at least one SMT fastening surface disposed at an underside of said heat sink base substantially at a right angle relative to said heat sink contact surface;
• and a suction face adapted to interact with an SMT pipette, said suction face being connected to said heat sink base substantially at a right angle to said heat sink contact surface and above said SMT fastening surface.

An electronic circuit comprising:

• a circuit board;
• an electronic component mounted on said circuit board;
• and
• a heat sink comprising a heat sink base, a heat sink contact surface in thermal contact with said electronic component to cool said electronic component, said heat sink contact surface and said heat sink base forming a wall having an upper side, said wall having a slot therein proceeding into said wall from said upper side, and a clamp element received in said slot and disposed to clamp a component to be cooled between said clamp element and said heat sink contact surface.