Shadow frame with cross beam for semiconductor equipment

A shadow framing system for a chamber in semiconductor manufacturing equipment comprising:

• a rectangular frame including a cross beam, the frame and cross beam having flush engagement surfaces configure to intimately contact a carrier disposed below the frame, and further configured to cover a metal interconnect area of the carrier;
• a susceptor disposed below the frame and configured to support the carrier against the frame, the susceptor including apertures, the apertures positioned below the engagement surfaces of the frame;
• and
• support elements including an engagement surface, the support elements configured to protrude through the apertures and contact a lower surface of the carrier at the engagement surface of the support elements.

A shadow framing system for a PECVD process chamber, comprising:

• a rectangular, anodized aluminum frame having edges that form four horizontal lips that extend approximately two centimeters toward a central area of the frame;
• and
• a thin, glass-like cross beam, having a width of approximately two centimeters, and a thickness of less than approximately one millimeter, disposed between at least two of the edges, an engagement surface of the cross beam configured to be flush with an engagement surface of the lips;
• wherein the engagement surfaces of cross beam and lips are configured to cover metal interconnect bonding areas on a carrier disposed below the frame.