Cooling device for wafer machine
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPao-Kun Liao, Wen-Tsai Su
Life of this patent
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Abstract
A device for rapidly cooling a semiconductor wafer test/transfer machine. The device includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.
Claims20
A cooling device comprising:
- a body having an gas entry opening, an exit gas opening and an gas passage connecting said gas entry opening to said exit gas opening;
- and
- a gas source provided in pneumatic communication with said gas entry opening.
A cooling device for cooling a semiconductor wafer machine, said cooling device comprising:
- a body having a contact surface for contacting the semiconductor wafer machine, an gas entry opening provided in said body, an exit gas opening provided in said contact surface of said body, and an gas passage connecting said gas entry opening to said exit gas opening;
- a gas source;
- and
- a pneumatic tubing connecting said gas source to said gas entry opening of said body for blowing gas through said gas passage and against the semiconductor wafer machine through said exit gas opening for cooling the semiconductor wafer machine.
A method of cooling a wafer holder in a semiconductor wafer machine having a cover adjacent to the wafer holder, comprising:
- providing a cooling device comprising a body having an gas entry opening, an exit gas opening, an gas passage connecting said gas entry opening to said exit gas opening, and a gas source provided in pneumatic communication with said gas entry opening;
- placing said body of said cooling device in contact with the cover of the semiconductor wafer machine, with said exit gas opening disposed against the cover of the semiconductor wafer machine;
- and
- delivering gas from said gas source, through said gas entry opening, said gas passage and said exit gas opening and against the cover for a time sufficient to cool the wafer holder.
Dependencies are inferred from the claim text.