Microelectroforming mold using a preformed metal as the substrate and the fabrication method of the same

Abstract

The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold. The invention shortens the electroforming time to be one third of the prior art, elongating the number of times the micro-electroforming mold can be used by a factor of more than three.

Dependencies are inferred from the claim text.