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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYuki Miyamoto, Yasuhiro Sato, Hajime Matsumoto
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A semiconductor manufacturing system of the present invention includes exposure value detection means for detecting an exposure value, pattern size detection means for detecting a pattern size, size comparison means for calculating a size difference between the pattern size and a target value, optimum exposure value calculation means for calculating an optimum exposure value based on the exposure value and the size difference, and an exposure value control means. In the semiconductor device manufacturing method of the present invention, the optimum exposure value is calculated based on the exposure value and the size difference, and exposure is performed at the optimum exposure value. A semiconductor device of the present invention is manufactured by the manufacturing method.
A semiconductor manufacturing system, comprising:
A semiconductor device manufacturing method, comprising the steps of:
A semiconductor device, comprising a pattern which is formed by exposing a photosensitive material at an optimum exposure value calculated by using a difference between a size of a pattern formed after photolithography and a target value as well as an exposure value of an exposure device during said photolithography, developing said photosensitive material after the exposure, and performing an etching process using said photosensitive material after said development.
Dependencies are inferred from the claim text.