Chip/package resonance damping using controlled package series resistance
AssigneeSun Microsystems, Inc.
InventorsClaude Gauthier, Brian Amick
Life of this patent
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Abstract
A method and apparatus for reducing an impedance of a power supply path of an integrated circuit is provided. The power supply path includes a first power supply line and a second power supply line to provide power to the integrated circuit. At least one resistive element connected between the first power supply line and the second power supply line is adjusted to reduce the impedance of the power supply path.
Claims13
An apparatus for reducing a power supply impedance of an integrated circuit, comprising:
- a package on which the integrated circuit is mounted;
- a power supply path on the package adapted to receive power from a power supply, wherein the power supply path comprises a first power supply line and a second power supply line to provide power to the integrated circuit;
- and
- at least one resistive element connected between the first power supply line and the second power supply line, wherein the at least one resistive element comprises a potentiometer to reduce the power supply impedance of the integrated circuit.
A method for reducing an impedance of a power supply path of an integrated circuit, wherein the power supply path comprises a first power supply line and a second power supply line, the method comprising:
- determining an impedance of the power supply path of the integrated circuit;
- and
- adjusting a value of a resistance connected between the first power supply line and the second power supply line to reduce the impedance of the power supply path.
An apparatus for reducing an impedance of a power supply path of an integrated circuit connected to the power supply path, wherein the power supply path comprises a first power supply line and a second power supply line, the apparatus comprising:
- means for determining an impedance the power supply path of the integrated circuit;
- and
- means for adjusting a value of a resistance connected between the first power supply line and the second power supply line to reduce the impedance of the power supply path.
Dependencies are inferred from the claim text.