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US 2003/0197270 A1Published application
Semiconductor device and method of fabrication of the same
AssigneeOki Electric Industry Co., Ltd.
InventorTae Yamane
Life of this patent
Estimating the term…
Abstract
A CSP type semiconductor device protects a circuit from the influences exerted by an external light on a circuit. In the CSP type semiconductor device, a light-shielding material, such as a silicone-based resin, an epoxy-based resin, or a metal, is deposited onto a side surface or a rear surface of a semiconductor chip where no circuit is formed.
Claims20
A semiconductor device comprising:
- a semiconductor chip having a side surface, a rear surface, and a front surface on which a circuit has been formed;
- and
- a metal film for blocking light,
- wherein the metal film covers the side surface and the rear surface of the semiconductor chip.
1 more element
A semiconductor device comprising:
- a semiconductor chip having a side surface, a rear surface, and a front surface on which a circuit has been formed;
- first and second resin films;
- and
- bump electrodes electrically connected to the circuit,
- the first resin film seals the front surface of the semiconductor chip,
- the second resin film is formed of an epoxy-based resin or a silicone-based resin, blocks light, and covers the side surface and the rear surface of the semiconductor chip, and
- the bump electrode is formed on the first resin film.
4 more elements
A semiconductor device comprising:
- a first main front surface on which circuit elements have been formed;
- a second main front surface substantially opposing the first main front surface;
- a semiconductor substrate having a plurality of side surfaces between the first main front surface and the second main front surface;
- a first resin film covering the first main front surface;
- a plurality of external terminals that are electrically connected to the circuit elements and project from the front surface of the first resin film;
- and
- a metal film that covers side surfaces of the semiconductor substrate and the second main front surface, and blocks light.
4 more elements
A semiconductor device comprising:
- a first main front surface on which circuit elements have been formed;
- a second main front surface substantially opposing the first main front surface;
- a semiconductor substrate having a plurality of side surfaces between the first main front surface and the second main front surface;
- a first resin film covering the first main front surface;
- a plurality of external terminals that are electrically connected to the circuit elements and project from the front surface of the first resin film;
- and
- a second resin film that covers side surfaces of the semiconductor substrate and the second main front surface, blocks light, and is formed of an epoxy-based resin or a silicone-based resin.
4 more elements
Dependencies are inferred from the claim text.