Semiconductor package with integrated conical vapor chamber
AssigneeIntel Corporation
InventorGerald A. Budelman
Life of this patent
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Abstract
A semiconductor package including a conical or pyramidal vapor chamber body coupled to a package bottom to enclose a vapor chamber within which are disposed a semiconductor die and working fluid. A matching conical or pyramidal heatsink is coupled to the vapor chamber body. The conical or pyramidal shape allows a tight fit and good thermal performance, without undue force being applied to the package bottom, and further allows a variety of heatsinks to be used with a standardized shape vapor chamber body.
Claims39
An apparatus comprising:
- a package bottom;
- a vapor chamber body coupled to the package body to encompass a vapor chamber, wherein the vapor chamber body has an exterior surface with a shape which is one of a conical shape and a pyramidal shape;
- and
- a semiconductor die disposed within the vapor chamber.
A heatsink comprising:
- a body having,
- an exterior surface, and
- a concave interior surface with a shape which comprises one of a conical shape and a pyramidal shape;
- a plurality of fins in thermal contact with the exterior surface.
A vapor chamber body comprising:
- a sidewall member having an exterior shape;
- wherein the exterior shape is one of,
- a conical shape, and
- a pyramidal shape;
- and
- the sidewall member has an open end at a large end of the exterior shape.
An apparatus comprising:
- a package bottom;
- a semiconductor die coupled to the package bottom;
- a conical vapor chamber body coupled to the package bottom to enclose a vapor chamber within which the semiconductor die is disposed;
- working fluid disposed within the vapor chamber;
- and
- a conical heatsink coupled to the conical vapor chamber body.
A method of packaging a semiconductor die which is coupled to a package bottom, the method comprising:
- coupling a conical or pyramidal vapor chamber body to the package bottom so as to enclose a vapor chamber within which are disposed the semiconductor die and working fluid;
- and
- coupling a conical or pyramidal heatsink to the conical or pyramidal vapor chamber body.
Dependencies are inferred from the claim text.