High performance cooling device with side mount fan
AssigneeHewlett-Packard Development Company, L.P.
InventorShankar Hegde
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorShankar Hegde
Estimating the term…
A side flow cooling device is disclosed. The side flow cooling device includes a heat mass with arms extending therefrom and a mounting surface for connecting the heat mass with a component to be cooled. The heat mass and the arms include a plurality of fins extending outward therefrom and aligned with a vertical axis of the heat mass. The fins have cooling surfaces and a slot between adjacent fins that are aligned with a longitudinal axis of the heat mass. A fan or the like can be connected with a side face of the cooling device to generate an air flow that is substantially along the longitudinal axis. The air flow wets over the cooling surfaces of the fins, on exposed portions of the heat mass, and on exposed portions of the arms to dissipate heat from the heat mass. The heat mass is not covered by the fan and therefore the fins can populate a substantial portion of a surface area of the heat mass thereby increasing the surface area available for cooling.
A side flow cooling device for dissipating heat from a component, comprising:
The side flow cooling device as set forth in claim 4 and further comprising a thermal interface material connected with the mounting surface and operative to thermally connect the heat mass with the component.
Dependencies are inferred from the claim text.