Heatsink device
AssigneeSunonwealth Electric Machine Industry Co., Ltd.
InventorsAlex Horng, Ching-Sheng Hong, Ying-Rong Hong
Life of this patent
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AssigneeSunonwealth Electric Machine Industry Co., Ltd.
InventorsAlex Horng, Ching-Sheng Hong, Ying-Rong Hong
Estimating the term…
A heatsink device includes a base board provided with multiple fins and multiple channels formed between any two adjacent fins. Each of the channels has a first end formed with an air inlet and a second end formed with an air outlet. The base board is provided with a mounting portion. An impeller is combined on the mounting portion of the base board, and a cover plate is combined on a top of the base board. The impeller includes a power member to drive a blast type vane to rotate. The vane is aligned with the channels formed between the multiple fins, to drive an air flow from the air inlet at one side of the base board to the air outlet at the other side of the base board.
A heatsink device, comprising:
Dependencies are inferred from the claim text.
No related US applications are recorded in the indexed filing history.
Backward citations are indexed for grants only.
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Involving heat exchange by flowing fluids: by flowing gases, e.g. forced air cooling
Generic packages, interconnections, connectors or other constructional details of devices covered by
Term end not estimated
1. Field of the Invention
The present invention relates to a heatsink device, and more particularly to a heatsink device that may drive a larger amount of air flow, and the heatsink air flow may be sucked from one side of the base board and may be carried outward from the other side of the base board.
2. Description of the Related Art
FIG. 1 is an exploded perspective view of a heatsiink device in accordance with a first embodiment of the present invention;
FIG. 2 is a top plan assembly view of the heatsink device as shown in FIG. 1, with the cover plate being removed;
FIG. 3 is a plan cross-sectional view of the heatsink device taken along line 3-3 as shown in FIG. 2;
Referring to the drawings and initially to FIG. 1, a heatsink device in accordance with a first embodiment of the present invention comprises a base board 1, an impeller 2, and a cover plate 3.
The base board 1 is made of a metallic material having a better heat conduction feature. The base board 1 has a bottom plate provided with multiple fins 11, and multiple channels 12 formed between any two adjacent fins 11. Each of the channels 12 has a first end formed with an air inlet 15 and a second end formed with an air outlet 16. The base board 1 is provided with a mounting portion 13 for mounting and fixing the impeller 2. The mounting portion 13 may be located at the air inlet 15 of the base board 1. In addition, the base board 1 is provided with multiple positioning portions 14, so that the cover plate 3 may be combined on the base board 1 easily. The positioning portion 14 may be a positioning hole or a groove as shown in the figure, so that the positioning member 31 of the cover plate 3 may be snapped on the positioning portion 14 of the base board 1. Further, the base board 1 may be provided with a receiving chamber 17 which aligns with the position of the power member 21 of the impeller 2, without disturbing the air flow. In addition, the receiving chamber 17 may be used to receive a circuit board 18 that is used to control operation of the power member 21 of the impeller 2.
The impeller 2 includes a power member 21, such as a motor, to drive a vane 22 to rotate. The vane 22 is a blast type vane that has elongated blades. The impeller 2 may be combined on the mounting portion 13 of the base board 1 in a conventional fixing manner as shown in the figure. The base board 1 is provided with multiple positioning holes 19 for passage of positioning members 23, such as bolts, which may be screwed into screw bores 24 formed in the power member 21 of the impeller 2, thereby fixing the impeller 2. The length of the vane 22 of the impeller 2 is substantially equal to the total width of the multiple fins 11 provided at the air inlet 15 of the base board 1. Thus, when the vane 22 is driven to rotate, a large quantity of air flow may be sucked into the air inlet 15 of the base board 1. The air flow may be driven to pass through each of the channels 12 of the base board 1, and may be carried outward from the air outlet 16 of the base board 1, so as to provide a heatsink effect to the base board 1 or the heat emitting member located at the air outlet 16 of the base board 1.