Socket assembly with vacuum pickup cap
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsNick Lin, Fang-Jwu Liao, Hsiang-Ping Chen, Chi-Hung Liu
Life of this patent
Estimating the term…
Loading patent…
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsNick Lin, Fang-Jwu Liao, Hsiang-Ping Chen, Chi-Hung Liu
Estimating the term…
A socket assembly (1) includes a socket (2) and a vacuum pickup cap (3). The socket includes a base (20), a cover (21) movably assembled upon the base and an actuating rod (22) assembled on both the base and the cover for driving the cover to move in relative to the base. The cover defines a through hole (200) in a center thereof. The vacuum pickup cap includes a flexible bottom plate (31) and a flexible film (32). The flexible bottom plate has a sticky bottom surface (310) adhered to an upper surface of the cover and covering the through hole of the cover. The flexible film has a sticky bottom surface (320) adhered to the flexible bottom plate and a smooth upper surface (321) adapted for being sucked by a vacuum pickup device.
A socket assembly adapted for being sucked by a vacuum pickup device, comprising:
An electrical connector assembly, comprising:
An electrical connector comprising:
An electrical connector comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Backward citations are indexed for grants only.
Incorporating a pick-up tool: sucking devices
Electrical connectors: including provision for mechanical lifting or manipulation, e.g. for vacuum lifting
Printed circuits
Technical subjects covered by former uspc cross-reference art collections [xracs] and digests
Term end not estimated
1. Field of the Invention
The present invention relates to a socket assembly, and particularly to a socket assembly with a vacuum pickup cap.
2. Description of Related Art
FIG. 1 is an exploded, perspective view of a socket assembly including a socket, a paper tape and a vacuum pickup film in accordance with the present invention;
FIG. 2 is a view similar to FIG. 1 with that the paper tape is adhered to the socket while the vacuum pickup film is not;
FIG. 3 is an assembled view of FIG;
Reference will now be made to the drawing figures to describe the present invention in detail.
Referring to FIG. 1, a socket assembly 1 of the present invention comprises a socket 2 and a vacuum pickup cap 3 to be adhered to the socket 2. The vacuum pickup cap 3 is for being sucked by a vacuum pickup device (not shown) to move the socket 2 from one place to another.
The socket 2 is used for electrically connecting an integrated circuit (IC) package (not shown) with a printed circuit board (not shown). The socket 2 comprises a base 20, a cover 21 movably assembled upon the base 20 with through holes 211 therein, and an actuating rod 22. The actuating rod 22 is assembled on both the base 20 and the cover 21 for driving the cover 21 to move relative to the base 20. The base 20 and the cover 21 each define a rectangular through hole 200 in a center thereof for well dissipating heat produced by the IC package. In addition, the cover 21 comprises an upper surface 210.