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AssigneeNone recorded
InventorTatsuya Suzuki
Estimating the term…
A semiconductor substrate stock/transfer vessel is an openable/closeable sealed vessel used in a semiconductor device manufacturing process and adapted to store or transfer a semiconductor substrate. The semiconductor substrate stock/transfer vessel incorporates at least one adsorbent capable of adsorbing an organic substance, and the adsorbent is mounted detachably.
A semiconductor substrate stock/transfer vessel, which is an openable/closeable sealed vessel used in a semiconductor device manufacturing process and adapted to store or transfer a semiconductor substrate,
A method of manufacturing a semiconductor device wherein a semiconductor substrate is stored in a stock/transfer vessel incorporating at least one adsorbent capable of adsorbing an organic substance during an operation wait time between respective steps of manufacturing said semiconductor device, said adsorbent being mounted detachably.
Dependencies are inferred from the claim text.
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Closed carriers: characterised by materials, roughness, coatings or the like
Characterised by atmosphere control: characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
Generic processes or apparatus for the manufacture or treatment of devices covered
Term end not estimated
1. Field of the Invention
The present invention relates to a stock/transfer vessel for a semiconductor substrate and a method of manufacturing a semiconductor device and, more particularly, to a stock/transfer vessel for a semiconductor device which is used in a semiconductor device manufacturing process and which can clean air in it, and a method of manufacturing a semiconductor device, which uses this stock/transfer vessel.
2. Description of the Prior Art
FIG. 1 is a schematic longitudinal sectional view showing a state wherein a plurality of semiconductor substrates are stored in a conventional semiconductor substrate stock/transfer vessel;
FIGS. 2A and 2B are a schematic vertical sectional view and a schematic horizontal sectional view, respectively, showing a state wherein a plurality of semiconductor substrates are stored in a semiconductor substrate stock/transfer vessel according to the first embodiment of the present invention;
FIG. 3 is a schematic longitudinal sectional view showing a state wherein a plurality of semiconductor substrates are stored in a semiconductor substrate stock/transfer vessel according to the second embodiment of the present invention;
Several preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First Embodiment:
FIGS. 2A and 2B show the schematic vertical sectional structure of a semiconductor substrate stock/transfer vessel 1 according to the first embodiment of the present invention, in which semiconductor substrates 11 are stored. The structure of this stock/transfer vessel and how to store semiconductor substrates will be described. Although the vessel or the like shown in FIGS. 2A and 2B has a rectangular shape for the sake of convenience, it is not limited to this shape, and a cylindrical vessel or vessels with other shapes can be suitably used.