Non-volatile memory capable of preventing antenna effect and fabrication thereof
AssigneeMacronix International Co., Ltd.
InventorsTung-Cheng Kuo, Chien-Hung Liu, Shyi-Shuh Pan, Shou-Wei Huang
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AssigneeMacronix International Co., Ltd.
InventorsTung-Cheng Kuo, Chien-Hung Liu, Shyi-Shuh Pan, Shou-Wei Huang
Estimating the term…
A non-volatile memory capable of preventing the antenna effect and the fabrication thereof are described. The non-volatile memory includes a word-line having a high resistance portion and a memory cell portion on a substrate and a charge trapping layer located between the word-line and the substrate. The high resistance portion is electrically connected with a grounding doped region in the substrate and the memory cell portion is electrically connected with a metal interconnect over the substrate.
A non-volatile memory capable of preventing an antenna effect, comprising:
A method for fabricating a non-volatile memory capable of preventing an antenna effect, comprising the steps of:
A method for fabricating a non-volatile memory capable of preventing an antenna effect, comprising the steps of:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Of FETs having insulated gates [IGFET]: of FETs having charge-trapping gate insulators, e.g. MNOS transistors
Of data-storage electrodes: comprising charge-trapping insulators
Semiconductor device manufacturing: process: making oxide-nitride-oxide device
Inorganic electric semiconductor devices
Term end not estimated
This application claims the priority benefit of Taiwan application serial no. 91107421, filed Apr. 12, 2002.
1. Field of Invention
The present invention relates to a structure of a semiconductor device and the fabrication thereof. More particularly, the present invention relates to a structure of a non-volatile memory capable of preventing the antenna effect and the fabrication thereof.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
FIG. 1 illustrates a top view of a non-volatile memory structure capable of preventing the antenna effect according to a first embodiment of this invention;
FIG. 2 illustrates a cross-sectional view of the non-volatile memory structure shown in FIG. 1 along the line II-II;
First Embodiment
Refer to FIG. 1, FIG. 1 illustrates a top view of a non-volatile memory structure capable of preventing the antenna effect according to the first embodiment of this invention.
As that shown in FIG. 1, a word-line 102 having a high resistance portion 104 and a memory cell portion 106 is located on a substrate 100. The high resistance portion 104 of the word-line 102 is narrower than the memory cell portion 106 in order to have a higher resistance and is electrically connected with a grounding doped region 108 formed in the substrate 100 via a contact 112. The memory cell portion 106 of the word-line 102 is electrically connected with a metal interconnect 110 via a contact 114.