Method for manufacturing semiconductor device
AssigneeSeiko Epson Corporation
InventorsSusumu Inoue, Akihiko Ebina
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AssigneeSeiko Epson Corporation
InventorsSusumu Inoue, Akihiko Ebina
Estimating the term…
A method for manufacturing a semiconductor device including a non-volatile memory device and a resistance element including a resistance conductive layer is provided. The method comprises the following steps: a step of pattering a stopper layer and a first conductive layer to form a gate layer; a step of patterning the stopper layer, a dielectric layer and the first conductive layer to form a resistance conductive layer; a step of forming sidewall-like control gates on both side surfaces of the gate layer through ONO films at least within a memory region; a step of forming a second conductive layer above the gate layer and the resistance conductive layer; a step of forming a word line by patterning the second conductive layer; and a step of forming a word gate by patterning the gate layer.
A method for manufacturing a semiconductor device including a non-volatile memory device, and a resistance element including a resistance conductive layer, the method comprising the steps of:
A method for manufacturing a semiconductor device including a non-volatile memory device and a resistance element including a resistance conductive layer, the method comprising the steps of:
A method for manufacturing a semiconductor device including a non-volatile memory device and a resistance element including a resistance conductive layer, the method comprising the steps of:
Dependencies are inferred from the claim text.
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EEPROM devices comprising charge-trapping gate insulators: characterised by the memory core region
Erasable-and-programmable rom [eprom] devices not provided for in groups h10b41/00 - h10b63/00
Aspects related to lithography, isolation or planarisation of the conductor: at least part of the entire electrode being a sidewall spacer, being…
Electronic memory devices
Term end not estimated
The present invention relates to a method for manufacturing a non-volatile memory device and a method for manufacturing a semiconductor device including the non-volatile memory device, and more particularly to a method for manufacturing a non-volatile memory device having a plurality of charge storage regions for each word gate, and a method for manufacturing a semiconductor device including the non-volatile memory device.
Non-volatile semiconductor memory devices include a MONOS (Metal Oxide Nitride Oxide Semiconductor) type and a SONOS (Silicon Oxide Nitride Oxide Silicon) type in which a gate dielectric layer between a channel region and a control gate is composed of a stacked layered body of a silicon oxide layer—a silicon nitride layer—a silicon oxide layer, wherein a charge is trapped in the silicon nitride layer.
One known MONOS type non-volatile memory device is shown in FIG. 22, (Y. Hayashi, et al, 2000 Symposium on VLSI Technology Digest of Technical Papers p.122-p.123).
FIG. 1 schematically shows a plan view illustrating a layout of a semiconductor device.
FIG. 2 schematically shows a cross-sectional view taken along line A-A of FIG. 1.
FIG. 3 shows one step in accordance with a first embodiment of the present invention.
First Embodiment
1. Structure Of A Semiconductor Device:
FIG. 1 is a plan view illustrating a layout of a semiconductor device that is obtained by a manufacturing method in accordance with a first embodiment of the present invention. The semiconductor device includes a memory region 1000 and a logic circuit region 2000. For example, a peripheral circuit for the memory and a resistance element 600 are formed in the logic circuit region 2000.